The FINEPLACER® core plus

The FINEPLACER® coreplus is a universal hot air rework station for electronic components and assemblies. The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA). This system is fully capable with rework of : - BGA, CSP, QFN, DFN, QFP, PGA, SOT etc., Package on Package (PoP), Underfilled and coated components , RF shields & RF frames, Mini BGA and other miniaturized components, Connectors & Sockets, Small passives down to 008004, Rework on FR4, flex, glass, ceramic or aluminium carrier, LED and Mini LED arrays, Daughter boards &Sub assemblies. Dipping ,Paste printing (component, PCB), Contactless site cleaning / Solder removal , Soldering, Component removal / de-soldering , Re-balling / Single ball re-balling and Dispensing. The Unique features : - • Full hot air rework system • Unique FINEPLACER® working principle • Industry-leading thermal management • In-situ process observation in HD • Data/media logging and reporting function • Full process access & easy visual programming with touch screen interface • Sequence control with predefined parameters • Placement accuracy better 10 µm • Versatile machine platform • Customer specific tooling • Overlay vision alignment system (VAS) with fixed beam splitter • 3-color LED illumination • Full process access and easy programming • Synchronized control of all process related parameters • Software controlled top heater calibration • Modular machine platform allows in-field retrofitting during entire service life • Individual configurations with process modules • Fully manual or semi-automatic machine versions • Force controlled component handling